Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. XCede ® HD is a small form factor system with a modular design for significant space savings and. 4, 6 or 8 columns. 2. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The 0. These modules consist of a 12. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators. 1 FMC VITA 57. Amphenol TCS XCede® Backplane Connectors. 2. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Find Parts Learn More. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office! 🤝🏙️ Excellent insights were shared by our distinguished speakers: 🌟 🎙️ Jon Howard from the BBC 🎙️ Chris Soulier from Cinch 🎙️ Gemma Turner from The Very. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. The XCede HD interconnect platform also has available RAM (Right Angle Male). They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Español $ USD United States. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Your Price. The XCede HD2 connector family consists of modular configurations with custom power and guidance modules. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. No spam. Formed in 2020 by a merger of three well. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 6. Pin header. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. Dislaime Please note that the above information is subect to change without notice. high speed performance, paddle card edge connector series for next Gen. 8 mm column pitch representing a 35% increase versus XCede®. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. We offer interconnection systems from 2. 3. Features & Benefits. 3-, 4- and 6-pair designs. 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. Integrated power and guidance. Amphenol XCede High Speed / Modular Connectors are available at Mouser Electronics. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. . 6. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 5 - Effective capacity assumes average 4:1 data reduction. Mouser offers inventory, pricing, & datasheets for Amphenol XCede High Speed / Modular Connectors. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Multiple signal/ground pin staging options. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. 7mil Drill Minimum Pad Size vs. See section 4 regarding XHD+ RAM connectors. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. Features & Benefits. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. 3. Available in straddle mount, through-hole termination and also SMT. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 2. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. DETAILS. 54, 3. 54mm pitch down to 0. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. challenging architectures. Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics. Features. These connectors are two-piece devices that connect two printed circuit boards. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCede® connectors also address. XCede® connectors also address Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCede® connectors also address. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. Modular design provides flexibility in applications. refer to c-922-4x0a-500 for signal connector detail. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 信号端子上可实现高达3. 85 Ω and 100 Ω options. XCede Product Family Connector Press-fit Installation Process . See Figure 15 for details. Contact Mouser (USA) (800) 346-6873 | Feedback. The series offers mechanical. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. DDR SDRAM - Evolution of High-Performance Volatile Memory. XCede® connector family. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. XCede® HD 1. ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。. Skip to Main Content (800) 346-6873. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. XCede® connectors also. 1. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. Contact us today for more details of XCede HD, part number 968-4200-A1H. Buy XCede HD Plus Series Backplane Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Three levels of sequencing enable hot plugging. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. XCede® connectors also address. use keep out zone. Features a simple design, normal or reverse mounting, push-push insert style and a locking technology therefore preventing the card from falling out. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2 mm, Receptacle, Press Fit, 2 Rows. View eCAD Files. XCede. distance curve will begin to further increase in slope. performance (up to 28+ Gb/s) in a Hard Metric form factor. XCede HD2 backplane interconnect system. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. Login or REGISTER Hello, {0}. XCede® connectors also address. BENEFITS. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. Connections hint for November 24. Skip to Main Content +49 (0)89 520 462 110. Close Modal. Article: 00028492. Features. 1. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 080 42650011. Amphenol is one of the leading manufacturers of Backplane connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. Get a Free Sample. Description Initial Date “A” S2401 Initial Release E. Available with 40, 60 and 80 signal pins. 三个等级的上电次序实现了热插拔. 4-, 5-, 6-, 8-pair configurations. C&K Components. 1. We would like to show you a description here but the site won’t allow us. 3、4和6对设计. 99 $ 19. You previously purchased this product. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). XCede® Family Cable Assemblies MATERIAL §§Contacts: High performance Copper Alloy §§Plating(s): Performance-based plating at separable interface (Telcordia GR-1217-CORE) §§Housings: High Performance Thermoplastic, UL94-V0. See Appendix "A" for the seating press recommendations and process recommendations. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. This type of cable is suitable for high-density networks and can reach a much longer distance than DAC and AOC. Features. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. EN. 5 application, evolved up to the further PCIe Gen. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. 1. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. 2. The inserts can be installed as per the. . 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. Back. Search for: Search Home; Categories. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. 2. 4、6或8列. XCede® connector family. REPAIR PROCEDURE FOR MODULE SEE TB-2217. Skip to Main Content (800) 346-6873. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. High-density backplane system – up to 84 differential pairs per linear inch. XCede ® HD and XCede ® HD Plus, this connector provides . Login or REGISTER Hello, {0}. Power blades rated up to 60 A per power bank. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. 3. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 0177" drill, nano ni, std gold 1. 4 differential pairs/inch. 4, 6 or 8 columns. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. XCede ® HD is a small form factor system with a modular design for significant space savings and. +44 (0)203 301 9900. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. For a 4-pair differential connector per column, 54. Buy XCede HD Series Backplane Connectors. 3. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Login or REGISTER Hello, {0}. . 0 REFERENCE 2. 1. 80mm Right-Angle Backplane Receptacle; HDTF - Samtec XCede® HD 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 423-0155-500 MOUNTING BLOCK. XCede® connectors also. Features. Description Value; ECCN: EAR99. 2. signal connector (J_BP_SIG) 5. Standard or high-speed wafers available. If you use the QSFP transceivers in the QSFP28 100G port, keep in mind that you have both single-mode and multimode (SR/LR) optical transceivers and Twinax/AOC options that are. Three levels of sequencing enable hot plugging. 提供集成式导引、锁合以及顶针侧壁. Discover More. 99. Upload your CV. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Amphenol is one of the leading manufacturers of Backplane connectors. 80 mm column pitch. High-density backplane system – up to 84 differential pairs per linear inch. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Login or REGISTER Hello, {0}. EN. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Contact us today for more details of XCede HD, part number 968-4200-A1H. Please confirm your currency selection:2. Up to 82 differential pairs. English. 2. Samtec XCede® HD HPTS 3. KK connector systems are customizable for a variety of power and signal applications. XCede® connectors also address. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. 00 mm contact wipe on signal pins. We offer interconnection systems from 2. Spacone 5-29-12 XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. 96 and 5. Features. FEATURES. TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. During this. Available in industry-standard 2. 4. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 2. 1. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. 8 mm, Header, Press Fit. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. XCede® connectors also address. Dislaime Please note that the above information is subect to change without notice. These connectors are two-piece devices that connect two printed circuit boards. Xcede® HD High Speed Backplane Connectors. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. EN. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. 0 REFERENCE 2. 2-, 3-, 4-, 5-, 6-Pair configurations. XCede® connectors also address. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. Across our key areas, our experts operate with a. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. 4. Each ball and socket mount is designed and manufactured using the highest quality materials, and is backed by a lifetime warranty. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. Backwards mate compatibility. 1. For XCede HD RAM. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 32. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. 80 mm高密度背板垂直插头. Get a Free Sample. BENEFITS. Find Parts. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. 4, Gen. Features. XCede® connectors also address. Two press-fit sizes, (standard and small) provide board layout options for designers. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. 1. 3. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® HD 1. Amphenol Communications Solutions. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 0 REFERENCE 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. As a high-density, high-speed backplane connector, the XCede ® HD product line provides a robust solution for tighter card pitches and chassis designs where space requirements and. Free shipping on many items | Browse your favorite brands | affordable prices. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. § Differential pairs 28-84 per inch (11-33 differential pairs perBack view of 24 x 2. 7mil Drill Minimum Pad Size vs. . 3-, 4- and 6-pair designs. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. Integrated power and guidance. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. TARGET MARKETS. Sign Up or Register. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Board-to-board connector / rectangular / SMT. Change Location. Once the XCede connector standoff features begin to come in contact with the PWB surface, the force vs. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Skip to Main Content (800) 346-6873. 1. 60mm (. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Description Initial Date “-“ S1188 Initial Release T. screw length and part number are dependent on daughtercard thickness (as specified from configurator). DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co -planar applications. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82. Your session is about to timeout due to inactivity. Mechanical longevity and ruggedness. Login or REGISTER Hello, {0}. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. Wang 6/19/19. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. Login or REGISTER Hello, {0}. 0 TOOLING 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. Login or REGISTER Hello, {0}. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. SERIES Maximum signal pins Terminal pin orientation Connector Length Type Termination Row REMARKS; HM2A30: 6 Spl: Vertical: 50. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 提供集成式导引、锁合以及顶针侧壁. DC Connector Configurations. Integrated power, guidance, keying and side walls available. Page 174 Figure 127. 2. XCede® connectors also address. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. Send us a Message. These connectors are two-piece devices that connect two printed circuit boards. Jump to a Section. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4 - Four (4) Onboardports by default . 三个等级的上电次序实现了热插拔. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. XCede ® HD2 was introduced to support PCIe ® 5 and XCede ® HD3 (in development) is targeting support of 112G PAM4 with future PCIe ® Gen 6 support in. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 7. See section 4 regarding XHD2 RAM connectors. 1.